원통형 스퍼터링 장치로 제작한 Ti 및 Al 박막구조
- 저자
- 오*섭, 한창석
- 게재저널
- 한국재료학회지
- 키워드
- metal films, magnetron sputtering apparatus, cylindrical target, columnar structure, granular structure.
- 개요
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Metal films (i.e., Ti, Al and SUH310S) were prepared in a magnetron sputtering apparatus, and their crosssectional structures were investigated using scanning electron microscopy. The apparatus used consisted of a cylindrical metal target which was electrically grounded, and two anode rings attached to the top and to the bottom of the target. A wire was placed along the center-line of the cylindrical target to provide a substrate. When the electrical potential of the substrate was varied, the metal-film formation rate depended on both the discharge voltage and the electrical potential of the substrate. As we made the magnetic field stronger, the plasma which appeared near the target collected on the plasma wall surface and thereby decreased the bias current. The bias current on the conducting wire was different from that for cation collection. The bias current decreased because the collection of cations decreased when we increased the magneticcoil current. When the substrate was electrically isolated, the films deposited showed a slightly coarse columnar structure with thin voids between adjacent columns. In contrast, in the case of the grounded substrate, the deposited film did not show any clear columns but instead, showed a densely-packed granular structure. No peeling region was observed between the film and substrate, indicating good adhesion.
- 첨부파일
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